Senior Engineer, Packaging Engineering at Sandisk

Batu Kawan, Penang, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

02 Jun, 26

Salary

0.0

Posted On

04 Mar, 26

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

SBA, Laser Marking, Laser Cutting, PKG Saw, Painting, Process Development, Process Optimization, Material Evaluation, New Product Design, Technology Targets, AutoCAD, 3D Drawing, Animations, Solidworks, JMP, Spotfire

Industry

Semiconductor Manufacturing

Description

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. Job Description ESSENTIAL DUTIES AND RESPONSIBILITIES: BOP (Back‑End of Process) AOI processes include SBA, Laser Marking, Laser Cutting, PKG saw and Painting development for LGA/BGA product assemblies Develop and optimize new BOP process recipes to achieve high capability for new products Collaborate with the material team on evaluation of new package‑related materials Work with the Packaging team on new product design, evaluation, and introduction Partner with the Pathfinding team to achieve leading PKG technology targets Qualifications REQUIRED: Bachelor or above, major in Automation, Mechatronics, Materials Science and Technology, etc 1-3 years’ process experience in Assembly PREFERRED: Strong knowledge at assembly process Good at AutoCAD, 3D drawing, Animations, Solidworks, JMP (or other similar statistic software, Spot-fire) etc Familiar with one of programming language will be a plus SKILLS: Good communication skill at both Chinese and English Willing to work under certain pressure and team work spirit Additional Information Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying. NOTICE TO CANDIDATES: Sandisk has received reports of scams where a payment is requested on Sandisk’s behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Sandisk Ethics Helpline or email [email protected]. Business Function: Packaging Engineering Work Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office

Responsibilities

The role involves developing and optimizing Back-End of Process (BOP) AOI processes, including SBA, Laser Marking, Laser Cutting, PKG saw, and Painting for LGA/BGA product assemblies. This includes collaborating on new material evaluations and partnering with teams on new product design and achieving leading package technology targets.