Senior Engineer, Packaging Engineering at Sandisk

Batu Kawan, Penang, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

28 Apr, 26

Salary

0.0

Posted On

28 Jan, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

IC Package Requirements, SMT Process Development, Statistical Analysis, Quality Tools, Process Control Systems, Failure Analysis, Problem Solving, Material Development, AI/ML Integration, Communication Skills, Team Leadership, Data Analysis, Process Stability, Manufacturing Support, Technical Documentation, Experimental Design

Industry

Semiconductor Manufacturing

Description

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. Job Description ESSENTIAL DUTIES AND RESPONSIBILITIES: Defines IC package/SMT/SSD drive requirements, goals, and milestones for all SSD product groups and customer requirements. Develops SSD assembly and IC packaging material and processes to meet quality, reliability, cost, yield, productivity and manufacturing requirements. Develops new package and SMT process qualification programs. Prepares and/or updates specifications for piece parts of integrated circuits or semiconductor assemblies. Plans and conducts experiments to fully characterize material and processes throughout pathfinding to development to ramp. Develops solutions to improve quality, reliability, cost, yield, process stability/capability, productivity, and safety utilizing formal education, experience, statistical knowledge, and problem-solving tools. Establishes process control systems. Transfers process to high volume manufacturing and provide support in new factory start-up. Acts as a liaison with suppliers/vendors. Maintains product quality while developing and introducing package cost reduction programs. Coordinates the introduction of new package processes into production. Using appropriate tools, performs integrity analysis of packages. PME Specific Role Description includes the following but not limited to: SMT material and process development SMT AI/ML integration development SMT technology (material/process/metrology/equipment) pathfinding & roadmap Stencil design/development for new components DFM assessment and NUDD risk management Process-Material-Component-board-drive interactions assessment DOE & Mechanical and Material Lab Tools & Failure Analysis knowledge Quality Tools: FMEA, 8D, DMAIC, IPC knowledge etc. Statistical Tools: Statistical analysis (JMP/Minitab), Green Belt/Black Belt certification Special engineering characterization & improvement projects Factory emergency taskforce support Qualifications PTDI team embodies a high performance culture, marked by highly analytical, attention-to-details, hyper-productive, highly hands-on individuals. They work together to solve difficult problems. They are innovative. They possess the elusive “complete ownership” characteristic and have strong engineering pride, always willing to go above and beyond. REQUIRED: Bachelor/Master/PhD engineering/material/science required plus min 5 years of relevant work experience, min 2 year for PhD. Relevant work experience must be in engineering role within semiconductor industry. Academic studies must be in applicable field of engineering/science and demonstrate an academic record of excellence. PREFERRED: Demonstrated track record to pathfinding and development new SMT material such as paste and epoxy with vendors and utilizing test methodology to qualify new material in factory. Demonstrated track record to rapidly analyze and solve complex engineering issues by pursuing a focused solution path with a clear understanding of technical fundamental on root causing thru failure analysis report (EDX/FTIR etc), simulation report, mechanical (shadow moire) analysis report, or any relevant metrology data collection. Demonstrated track record working hands-on around technical equipment and processes (including metrology and semiconductor failure analysis techniques) Proficient in statistical analysis towards problem solving and the use of Minitab or JMP and Excel Demonstrated track record to summarize complex data sets for technical and non-technical audiences; elegant in DOE design and execution Highly self-motivated and self-directed with demonstrated ability to work well with people; have strong inter-cultural intuition Proven success leading technical team(s) in previous work experience SKILLS: Track record of AI/ML experience is added advantage. Strong verbal and written communications skills Additional Information Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying. NOTICE TO CANDIDATES: Sandisk has received reports of scams where a payment is requested on Sandisk’s behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Sandisk Ethics Helpline or email [email protected]. Job Type (exemption status): Exempt position - Please see related compensation & benefits details below Business Function: Packaging Engineering Work Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office

Responsibilities

The Senior Engineer will define IC package and SMT requirements, develop assembly and packaging materials, and establish process control systems. They will also act as a liaison with suppliers and coordinate the introduction of new package processes into production.