Senior Engineer, Packaging Engineering at Sandisk

Batu Kawan, Penang, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

16 Sep, 26

Salary

0.0

Posted On

18 Jun, 26

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

SiP Package Integration, DFx Analysis, Experimental Design, Statistical Analysis, Failure Analysis, Finite Element Analysis, Package Qualification, FMEA, SPC, Semiconductor Assembly, Product Development, Communication Skills

Industry

Semiconductor Manufacturing

Description

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. Job Description ESSENTIAL DUTIES AND RESPONSIBILITIES: You will work as SiP (System In Package ) package integration engineer in packaging engineering group. Leads new SiP product development from concept design and qualification to mass production. Generate innovative product concepts and transform them into tangible, market-ready products. Work closely with global functional teams in US, India, China, and Taiwan, review feasibility design drawings and propose design options. Collaborate extensively with internal teams, validate design options through characterization builds, perform comprehensive DFx (Design for x) analysis, Product performances , Quality , Cost , Manufacturability and etc, as well as review mechanical and electrical simulations, initiate assembly process flow, and deliver most optimized design for manufacturing with yield and quality. Ensuring build readiness, execute package qualification plan, follow up package reliability status, investigate and close failures on time. Monitor assembly and test yield on engineering/customer sample and low volume production builds. Drive yield improvement and manage excursions. Lead new product from low volume to high volume production transition with yield and quality meeting goals. Ensure FMEA, SOD, Control Plan, recipe guideline, SPC and other assembly controls are ready prior to high volume production. Lead new technology transition (new wafer tech/process/material) from engineering stage to volume production. Qualifications REQUIRED: Master’s degree in Material Science, Polymer Science, Mechanical Engineering, or other engineering disciplines or Bachelor' degree with minimum 2 years of relevant work experience PREFERRED: Proficient understanding of packaging domains in semiconductor SiP assembly ( DP / DA / WB / Mold & backend process), packaging materials and failure analysis. Additional knowledge in areas like board level reliability , FEA ( Finite Element Analysis ) will be added advantages Self-motivated and self-directed Strong work ethic, capable of performing effectively under high-pressure situations, and maintaining composure in the face of uncertainties SKILLS: Exceptional problem-solving skills with expertise in experimental design and statistical analysis Excellent communication skills, enabling collaboration with global functional teams Additional Information Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying. NOTICE TO CANDIDATES: Sandisk has received reports of scams where a payment is requested on Sandisk’s behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Sandisk Ethics Helpline or email [email protected]. Job Type (exemption status): Exempt position - Please see related compensation & benefits details below Business Function: Packaging Engineering Work Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office

Responsibilities

Lead the development of System In Package (SiP) products from concept design and qualification through to mass production. Collaborate with global teams to optimize design for manufacturability, yield, and quality while managing technology transitions.