Senior Engineer Unit Process Development Die Attach at Infineon Technologies

Malacca City, Malacca, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

09 Sep, 26

Salary

0.0

Posted On

11 Jun, 26

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Die Attach Process, FOL Process, DOE, Statistical Analysis, Root Cause Analysis, Project Planning, Cross-functional Leadership, Process Characterization, Risk Assessment, Lean Six Sigma, JMP, Minitab

Industry

Semiconductor Manufacturing

Description

Conduct process development activities, including scouting for process parameters, optimization, verification, and process freeze, within development projects to achieve project objectives related to timeline, quality, cost competitiveness, and manufacturability. Your Role Key responsibilities in your new role Development of innovative processes and process characterization methodologies for existing and new technologies. Perform risk assessment & identify technical challenges. Ensure effective technical communication and knowledge transfer to Operations. Support prototype and development samples build. Provide inputs for updating of related documents and is responsible for their correct contents, e.g, Process Specification, Assembly Design Rule, Process Roadmap, Failure Catalogue, Control Plan, FMEA, OJTI/WI, T32 etc for development projects. Collaborate with suppliers to promote continuous improvement and carry out verification and qualification activities for new tooling, machinery, and materials in development projects. Provide technical consultation and guidance team to ensure team success in daily tasks and projects. Technical lead for task forces and complex problem-solving teams, utilizing statistical and analytical tools, such as Root Cause Analysis/Finding using, 5 whys, DMAIC, 8D approach/methodology. Your Profile Qualifications and skills to help you succeed Masters/Bachelor's Degree in Engineering or relevant course with 3 years of working experience in the semiconductor manufacturing industry or other relevant industry. Strong hands-on knowledge and skills in FOL process / Die Attach process. Proficient in JMP, Minitab, or equivalent tools for DOE and statistical analysis. Good analytical and problem-solving skills. Good project planning, strong sense of quality and urgency. Team player with good communication, presentation skills, and interpersonal skills. Ability to work independently and lead cross-functional teams. Lean Six Sigma certification is an advantage. #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.

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Responsibilities

Lead process development activities for Die Attach technologies, including optimization, verification, and process freeze to meet project objectives. Provide technical leadership for complex problem-solving and ensure effective knowledge transfer to operations.