Senior Engineer Unit Process Engineering at Infineon Technologies AG Australia

Wuxi City, Jiangsu, China -

Full Time

Start Date

Immediate

Expiry Date

05 Apr, 26

Salary

0.0

Posted On

05 Jan, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Trim And Form, Dejunk, Tie Bar Cut, Lead Cut, Tooling Design, Process Documentation, FMEA, DOE, Statistical Tools, Lean-Six Sigma, Analytical Skills, Semiconductor Packaging, Cross-Functional Collaboration, Process Optimization, Troubleshooting, Communication

Industry

Semiconductor Manufacturing

Description

Trim and Form / Dejunk / Tie bar cut/ Lead Cut process know-how. Your Role Key responsibilities in your new role 1. Trim and Form / Dejunk / Tie bar cut/ Lead Cut process know-how. 2. Understand Equipment specifications, tooling design, process documentation(control plan, FMEA, OJTI), failure catalogues. 3. Tooling Design Rules ,Collaborate with R&D to design experiments, analyze results, and improve yield/performance. 4. Optimize Trim Form processes for advanced semiconductor packaging(e.g., lead frame-based devices).Troubleshoot process issues and implement corrective actions. 5. Support cross-functional teams in product launches and technology transfers. Your Profile Qualifications and skills to help you succeed 1.Bachelor’s/Master’s in Engineering (Materials, Mechanical, or Electrical). 2. 5+ years in semiconductor packaging or related fields. 3. Experience with Trim Form equipment and materials. Strong analytical skills and familiarity with DOE. 4. Strong knowledge of FMEA, SPC, lean-six sigma and other statistical tools ,Be able to use statistic tools for problem solving and further process improvement 5. Fluent communication both in Chinese and English. Contact: Alice.Shi-EE@infineon.cn, LinkedIn #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels. We look forward to receiving your resume, even if you do not entirely meet all the requirements of the job posting. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process. Click here for more information about Diversity & Inclusion at Infineon.

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Responsibilities

The role involves expertise in Trim and Form processes, including troubleshooting and optimizing processes for advanced semiconductor packaging. Additionally, the engineer will collaborate with R&D to design experiments and improve yield and performance.