Senior Engineer, Wire Bond Process Dev Engineering at Sandisk

Batu Kawan, Penang, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

22 Apr, 26

Salary

0.0

Posted On

22 Jan, 26

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Wire Bond Processes, Root Cause Analysis, Cross-Functional Collaboration, Process Optimization, SOP Maintenance, Continuous Improvement, Quality Performance, Manufacturing Support, JMP, Six Sigma, SPC, Project Planning, Communication Skills, Interpersonal Skills, Material Compatibility, Yield Improvement

Industry

Semiconductor Manufacturing

Description

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. Job Description ROLE SUMMARY Wire Bond Process Engineer is responsible for developing, optimizing, and sustaining wire bond processes to support new product introduction (NPI), yield improvement, and high‑volume manufacturing. This role works closely with cross‑functional teams to ensure robust process capability, strong quality performance, and smooth technology transitions. ESSENTIAL DUTIES AND RESPONSIBILITES: Define process windows and establish recipe baselines for Wire Bond processes using JMP DOE. Perform effective root cause analysis (5 Whys, DMAIC, 8D) for Wire Bond defects, equipment issues, and yield losses. Work closely with cross‑site Package Development teams to understand package design rules and Wire Bond requirements (pad layout, bondability, material compatibility). Ensure smooth transition from Development to NPI/Qualification, focusing on Wire Bond process readiness. Collaborate with manufacturing, equipment, and process development teams to optimize Wire Bond parameters, bonding programs, and equipment capability. Prepare and maintain SOP, WI, FMEA, OCAP, and Control Plan related to Wire Bond processes. Ensure effective handover of Wire Bond processes to production for new device/product introduction. Handle new material/component first article inspection (e.g., wire type, capillary, leadframe, substrate bondability). Drive continuous improvement in Wire Bond cost, UPH, yield, and material efficiency. Maintain strong process control to meet Wire Bond yield, throughput, and quality targets. Report Wire Bond non‑conformance/customer complaints and follow through on corrective actions. Qualifications REQUIRED: Min Bachelor or higher Engineering degree (Material/Mechanical/ Mechatronics/E&E, Physics & etc). Possessed at least 2-4 years of working experience in wire bond development process. PREFERRED: Hands on personality – production line focus personnel. Good project planning, strong sense of quality and urgency. Team player with good communication and interpersonal skills. SKILLS JMP/MiniTab /8D /Six Sigma/ SPC. Additional Information Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying. NOTICE TO CANDIDATES: Sandisk has received reports of scams where a payment is requested on Sandisk’s behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Sandisk Ethics Helpline or email [email protected]. Job Type (exemption status): Exempt position - Please see related compensation & benefits details below Business Function: Packaging Engineering Work Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office

Responsibilities

The Wire Bond Process Engineer is responsible for developing and optimizing wire bond processes to support new product introduction and yield improvement. This role involves collaboration with cross-functional teams to ensure robust process capability and smooth technology transitions.