Senior Equipment Engineer at NXP Semiconductors

Bangkok, , Thailand -

Full Time

Start Date

Immediate

Expiry Date

19 May, 26

Salary

0.0

Posted On

18 Feb, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Equipment Overhaul, Machine Reliability, Preventive Maintenance, Calibration, Continuous Improvement, Process Optimization, Root Cause Analysis, Corrective Actions, Automation Systems, Technical Training, Mentorship, Safety Compliance, Project Leadership, Troubleshooting, Data Analytics, Machine Connectivity

Industry

Semiconductor Manufacturing

Description

Role & Responsibilities Lead and manage wire bond equipment overhaul and rebuild activities to ensure maximum machine uptime and reliability. Develop and implement preventive maintenance programs and calibration procedures for wire bond machine. Drive continuous improvement initiatives focused on equipment performance, process optimization, and quality enhancement. Analyze equipment downtime and root causes; implement corrective actions to minimize recurrence. Collaborate with cross-functional teams to support production goals, improve equipment utilization, and meet customer quality requirements. Develop innovative solutions and automation systems to enhance machine connectivity, reduce manual intervention, and improve operational efficiency. Provide technical training and mentorship to engineers on wire bond equipment troubleshooting, overhaul, and process control. Ensure compliance with environmental, safety, and quality standards in all equipment-related activities. Lead projects that deliver measurable improvements in productivity, cost reduction, and quality performance. Qualification Education: Bachelor’s degree in Electronics, Electrical, Mechanical, or related Engineering field. Experience: Minimum 7 years of hands-on experience in wire bond equipment engineering or semiconductor assembly operations. Proven expertise in wire bond machine platforms. Strong background in machine overhaul, rebuild, calibration, preventive and predictive maintenance. Demonstrated ability to manage major repairs, restoration, and equipment qualification. Solid understanding of quality systems, SPC, and root cause analysis for equipment-related issues. Experience in continuous improvement methodologies (Lean, Six Sigma) and driving cost-reduction projects. Ability to develop and implement automation and innovative solutions for equipment and process improvement. Excellent analytical, troubleshooting, and problem-solving skills. Strong leadership and communication skills; ability to train and mentor technical teams. Familiarity with data analytics and machine connectivity projects is a plus. More information about NXP in Thailand... #LI-9599 NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer, and more sustainable world through innovation. As the world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. For more information, visit www.nxp.com Bright Minds. Bright Futures. We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills. Commitment At NXP. We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future. We remain steadfast in our commitment to sustainability and making measurable year-on-year progress. Also, we aim to create an inclusive work environment and we will not tolerate racism, discrimination or harassment of any kind. We have programs in place focused on diversity, inclusion and equality. Thank you for considering a career at NXP. To help you prepare for the different steps in our hiring process, see the following useful advice and tips. Are you already an NXP employee? Do not apply here. Instead, you must apply via our internal career page. Thank you for your interest in supporting our recruitment efforts. Please note that NXP operates under a strict Preferred Supplier List (PSL) for all recruitment activities. Any candidate profiles or resume submitted without a prior written agreement or explicit request from our Talent Acquisition team will be considered unsolicited. Such submissions will be deemed free of any obligations, and no fees will be paid by NXP or any of its affiliates, subsidiaries, or divisions - regardless of whether the candidate is hired, either coincidentally or otherwise. Thank you for your understanding.

Responsibilities

The role involves leading and managing wire bond equipment overhaul and rebuild activities to maximize machine uptime and developing preventive maintenance programs and calibration procedures. Responsibilities also include driving continuous improvement, analyzing downtime, implementing corrective actions, and developing automation solutions.