Start Date
Immediate
Expiry Date
28 Jul, 26
Salary
0.0
Posted On
29 Apr, 26
Experience
5 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Flip chip process, Statistical process control, Engineering change control, Data analytics, Die attach, Reflow process, Flux wash, ASM Die Bonder, Process optimization, Minitab, Spotfire, JMP, Root cause analysis, DMAIC, 8D report, Team leadership
Industry
Semiconductor Manufacturing
How To Apply:
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