Senior Manager, HIG HBM - Pkg PE at Micron Technology

Taichung, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

16 Feb, 26

Salary

0.0

Posted On

18 Nov, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Leadership Skills, Technical Skills, Project Management, Mentorship, Collaboration, Risk Analysis, Skill Enhancement, Cumulative Yield Ownership, Quality Improvement, Manufacturing Flows, Assembly Optimization, Test Optimization, Cross-Functional Collaboration, Technology Development, Semiconductor Industry, Problem Solving

Industry

Semiconductor Manufacturing

Description

Leadership Development: By coaching and providing career development, this role ensures the growth of future leaders in the semiconductor industry, which is vital for driving innovation and technological advancement. Skill Enhancement: The role involves identifying strengths and creating specific development plans to improve skills. This continuous skill enhancement is crucial to keep up with the rapidly evolving technology landscape. Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization. Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions. Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development. Product Alignment: Managing technical projects to align product performance and manufacturing flows across HBM products ensures consistency and high quality in the production process, which is key to the successful implementation of current and upcoming technology. Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products. Bachelors/Masters Electrical Engineering Degree with 10+ years of experience in the semiconductor industry. Demonstrating Strong Leadership Skills and Technical Skills Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems. Strong sense of responsibility and accountability towards assigned role with professional work ethic. Work on site in Taiwan with international travel to USA/Singapore if required Cumulative Yield Ownership: Work with cross-functional teams, to lead impactful initiatives that significantly enhance overall cumulative yield and quality improvement, driving substantial benefits for the organization. ASM Yield and DPM Improvement: Improve assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. Work on backend ASM bins optimization and calibration to improve yield and provide robust coverage for ASM related fallout. HBM Cube Yield Improvement: Improve HBM Cube yield through test optimization and coverages by collaboration with Technology Development and Packaging organizations to reduce Manufacturing Line Yield.

Responsibilities

The role involves leadership development, skill enhancement, and project management to ensure the growth of future leaders in the semiconductor industry. It also includes making technical decisions and managing projects to align product performance and manufacturing flows.