Senior Manager/ Manager, Advanced Packaging Technology Development - Packag at Micron Technology

, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

05 Apr, 26

Salary

0.0

Posted On

05 Jan, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Semiconductor Process, Equipment Engineering, Python, R, SQL, Data Analytics, Visual Basic, Fault Detection, Recipe Management, Process Control, Problem Solving, Communication

Industry

Semiconductor Manufacturing

Description

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing. We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing. We are looking for a Sr Manager/Manager to join our Advanced Packaging Technology Development (APTD) team! You will lead the package integration department to enable deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. Your responsibilities include but are not limited to collaborating with internal and external partners to building and implement strategies aligned to organizational and business objectives by delivering high performing and cost-effective advanced packaging solutions on time with highest quality and predictable reliability performance. Other responsibilities include ensuring organizational compliance to company policies, departmental procedures, providing organizational leadership for building and implementing department strategies, processes, and policy through active participation in functional teams and projects. Key responsibilities and duties include: Develop and Communicate Advanced Packaging Technology Development Strategy Develop and communicate Advanced Packaging Technology Development strategic objectives Understand the impact and implications of APTD strategy to the overall company strategy and direction Technical Leadership Set fiscal year technical objectives and insure they are aligned with department objectives Demonstrate understanding of technology complexity and effective technology decision making Provide technical leadership that may influence company direction Multi-Functional Leadership Represent APTD in providing cross department leadership in area of responsibility Work effectively with peers in other department to develop and drive multi-functional initiatives Impact and Execution Ensure accuracy, quality, and timeliness of results Guide best utilization of resources to achieve end results Ensure critical work, milestones and goals are met by the team Growth Mindset Continue to build new skills through development goals and learning events. Seek out opportunities to work multi-functionally, build a network, and gain competency across domains Training and Development: Conduct performance appraisals with team members to create goals and development plans Mentor other engineers and engage in continued learning to stay updated with the latest advancements in packaging technology Requirements B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields 8 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field, preferably in Technology Development Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics. Experience with Visual Basic for automation and tool integration. Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control. Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding. Experience in equipment development with fundamental understanding of post probe and assembly process and equipment interactions Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability Consistent track record to solve problems and address root causes Ability to multi-task and manage numerous projects simultaneously Tenacity to work effectively under timelines and limited resources Validated ability to lead small and large teams, directly or indirectly, toward common goals Outstanding communication and presentation skills, written and verbal to all levels of an organization About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg@micron.com Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron. AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Responsibilities

Lead the package integration department to enable deployment of advanced packaging technologies. Collaborate with internal and external partners to build and implement strategies aligned with organizational objectives.