Senior Mechanical Analysis Packaging Engineer at Intel - Dubai

Hillsboro, Oregon, United States -

Full Time

Start Date

Immediate

Expiry Date

21 Mar, 26

Salary

264470.0

Posted On

21 Dec, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Finite Element Analysis, Thermal Cycling, Reliability Risks, Cross-Functional Collaboration, Lab Testing, Material Behavior, Design-of-Experiment Studies, Simulation Workflows, Technical Problem-Solving, Communication Skills, Project Planning, Thermo-Mechanical Reliability, Advanced Packaging Technologies, Scripting, Automation, Yield Improvement

Industry

Semiconductor Manufacturing

Description

Job Details: Job Description: Develop and validate detailed finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages. Perform simulations to evaluate stress, strain, warpage, thermal cycling, and reliability risks across a wide range of package architectures. Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations. Design and coordinate lab tests and research on materials and properties to understand material behavior and reliability failure mechanisms. Support technology roadmap development by evaluating new materials, interconnect structures, and process flows from a thermo-mechanical reliability perspective. Drive design-of-experiment studies and sensitivity analyses to understand key drivers of package performance and reliability Contribute to the development and automation of internal simulation workflows, tools, and best practices to improve modeling efficiency and accuracy Develop solutions to problems utilizing formal education, experience and engineering judgment Communicate recommendation and solution space to internal and external customers. Responds to customer/client requests or events as they occur. Document and present simulation methodologies, results, and recommendations to both technical and executive audiences Stay current with industry trends, emerging technologies, and academic research in advanced packaging and simulation methodologies The candidate should also exhibit the following behavioral traits/skills: Strong communication skills across internal and external stakeholders and planning/prioritization skills for project success Ability to handle ambiguity and use appropriate skills (behavioral and/or technical) to drive clarity across stakeholders Willingness to lead and influence both external and internal teams Willingness to work independently with minimal supervision Technical problem-solving skills in a highly dynamic team environment Note: This role requires regular onsite presence to fulfill essential job responsibilities. Provides tactical and strategic operational support to ensure the successful development and ramp of a high volume or technology development fabrication facility. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences. Minimum Qualifications: Master's Degree in Mechanical Engineering, Chemical Engineering, Material Sciences or a related field and 7+ years of industry experience -OR- PhD Degree in Mechanical Engineering, Chemical Engineering, Material Sciences or a related field and 4+ years of industry experience Industry experience should include the following: Thermo-mechanical FEA modeling in semiconductor packaging domain At least one of the commercial FEA tools such as ANSYS, ABAQUS and COMSOL Advanced packaging technologies such as Foveros, EmIB, Cowos and Hybrid bonding. Semiconductor packaging processes, including die attach, underfill, molding, bumping, surface mount and reflow. Preferred Qualifications: Experience with multi-physics simulations, including coupled electro-thermal-mechanical analysis, free surface two phase flows, electroplating and plasma Familiarity with JEDEC reliability standards and qualification tests Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows Experience in technical program management in any assembly or test functional area Experience in driving yield improvement activities for advanced package architectures Previous related work experience in a semiconductor foundry preferred Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: US, Oregon, Hillsboro Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth. Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Benefits: We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here: https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003 Annual Salary Range for jobs which could be performed in the US: $136,990.00-264,470.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change. Intel’s official careers website. Find your next job and take on projects that shape tomorrow’s technology. Benefits Internships Life at Intel Locations Recruitment Process Discover your place in our world-changing work.

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Responsibilities

Develop and validate detailed finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages. Collaborate with cross-functional teams to define simulation requirements and provide actionable design and process recommendations.