Senior Mechanical Engineer at DRIVENETS

Raanana, Center District, Israel -

Full Time

Start Date

Immediate

Expiry Date

17 Oct, 26

Salary

0.0

Posted On

19 Jul, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Mechanical Design, Thermal Design, CAD, SolidWorks, Thermal Simulation, PCB Packaging, Heatsink Design, Airflow Optimization, Thermal Validation, Mechanical Analysis, Manufacturing Processes, Failure Analysis, System Integration, Materials Science, Mechanical Reliability, Cross-functional Collaboration

Industry

Software Development

Description

Location: Raanana #LI-Hybrid DriveNets is a leader in cloud-native networking software for Hyperscalers and service providers who are building the largest infrastructures in the world for network services and AI platforms. Founded in December 2015, DriveNets disrupted some of the most challenging high-scale markets, transforming the way Networks are built, scaled, and consumed. We also built the largest network in the world, with more than half of AT&T’s backbone running on DriveNets’ Network Cloud. DriveNets has raised 1B$ in four funding rounds which enable us to dream big and bring on the most talented people. We are looking for a highly experienced Senior Mechanical Engineer to join our Ethernet Product Hardware Engineering team. The team is responsible for the development of next-generation networking and routing platforms, from board-level design through complete rack-level system integration. As a Senior Mechanical Engineer, you will be responsible for the mechanical and thermal design of complex communication systems deployed within telecom and datacenter racks. You will work closely with Hardware, PCB, System, Manufacturing, and Reliability teams to ensure optimal thermal performance, mechanical robustness, serviceability, and manufacturability throughout the product lifecycle. Requirements Bachelor's degree in Mechanical Engineering or a related discipline. Proven experience in mechanical and thermal design of electronic systems. Proven experience designing systems integrated within telecom, networking, or datacenter racks. Deep understanding of thermal management principles for high-power electronic equipment. Strong expertise in PCB packaging, component placement considerations, and board-level thermal design. Proven experience performing thermal simulations and mechanical analyses using industry-standard tools. Advanced proficiency in CAD software such as SolidWorks or equivalent 3D mechanical design tools. experience with heatsink design, airflow optimization, and thermal validation methodologies. Hands-on experience with laboratory thermal testing, instrumentation, and failure analysis. Strong understanding of materials, manufacturing processes, tolerances, and mechanical reliability. Experience working with external manufacturers and suppliers, including teams in Asia, is an advantage. Excellent communication and collaboration skills with cross-functional engineering teams

Responsibilities

Responsible for the mechanical and thermal design of complex communication systems for telecom and datacenter racks. Collaborates with cross-functional teams to ensure optimal thermal performance, robustness, and manufacturability throughout the product lifecycle.