Start Date
Immediate
Expiry Date
07 May, 26
Salary
0.0
Posted On
06 Feb, 26
Experience
5 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
NPI Activities, Process Optimization, Device Qualification, Risk Assessment, Failure Analysis, Prototype Sample Build, Project Management, Problem-Solving, Semiconductor Assembly, Process Engineering, Wafer Back Grind, Dicing, Screen Printing, Die Attached, Wire Bonding
Industry
Semiconductor Manufacturing