Start Date
Immediate
Expiry Date
25 May, 26
Salary
0.0
Posted On
24 Feb, 26
Experience
5 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
New Product Setup, Process Optimization, Device Qualification, Prototype Sample Build, Process Window Study, Risk Assessment, Technical Challenges Identification, Material Characteristic Study, Failure Analysis, Reporting, Project Management, Problem-Solving, Semiconductor Assembly Manufacturing, Process Engineering, Wafer Back Grind, Dicing
Industry
Semiconductor Manufacturing