Senior OSAT Engineer at Altera

Taipei, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

08 Apr, 26

Salary

0.0

Posted On

08 Jan, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

OSAT Engineering, Semiconductor Assembly, Packaging, Test Engineering, Yield Optimization, Cost Improvement, Reliability Testing, Process Control, Data Analysis, Cross-Functional Collaboration, Technical Communication, Manufacturing Principles, NPI Readiness, Quality Improvement, Supplier Engagement, Root Cause Analysis

Industry

technology;Information and Internet

Description

Job Details: Job Description: About Altera Altera is a global leader in FPGA and programmable logic solutions, enabling innovation in data center, communications, automotive, aerospace, and industrial markets. As we expand manufacturing capabilities for next-generation programmable devices, we are strengthening our OSAT engineering organization to deliver world-class backend manufacturing performance. Role Summary We are seeking a highly skilled Senior OSAT Engineer to drive outsourced assembly and test engineering activities across Altera’s global supplier network. You will lead NPI readiness, yield optimization, cost improvements, and qualification activity for packaging and test flows supporting Altera’s FPGA/SoC product lineup. This role requires strong semiconductor backend engineering experience, hands-on problem solving, and the ability to collaborate closely with OSAT partners and cross-functional stakeholders. Key Responsibilities Lead technical engagement with OSAT suppliers on assembly and test process development, yield ramp, quality improvement, and volume manufacturing readiness. Drive new product introduction (NPI) from engineering builds through production release, ensuring OSAT capability meets electrical/thermal/mechanical requirements for FPGA and SoC products. Optimize packaging and test architectures for performance, cost, and reliability: flip-chip BGA, high-pin-count packages, substrate technologies, wafer-level solutions, burn-in/FT coverage. Monitor and improve backend yield performance using data-driven analysis; identify systemic issues and lead root cause / corrective actions. Partner with Test Engineering, Packaging, Product Engineering, DFM, and Quality teams on process optimization, failure analysis, and manufacturability improvements. Implement and maintain process control systems, SPC methodologies, automation improvements, and lean manufacturing principles at OSAT. Support cost reduction initiatives including BOM optimization, process simplification, and cycle time improvements. Track supplier performance metrics (yield, DPPM, cost, cycle time, OEE) and provide updates with risk assessments and mitigation plans. Lead or support reliability testing and package qualification activities aligned to industry standards (JEDEC, IPC, AEC-Q). Maintain strong technical relationship and communication cadence with OSAT partners to ensure transparency, collaboration, and escalation management. Qualifications: Minimum Requirements Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field. 10+ years of semiconductor assembly, packaging, or test engineering experience. Hands-on experience with OSAT manufacturing environments, including wafer finishing, substrate attach, interconnect packaging, test, and burn-in. Strong technical understanding of backend manufacturing flows: flip-chip, wire bond, underfill, molding, final test, reliability stress and analysis. Proven ability to analyze yield, reliability, and cost data to drive engineering decisions and improvements. Demonstrated success working with international suppliers and cross-functional teams. Strong written and verbal communication skills, including technical reporting and supplier engagement. Preferred Qualifications FPGA, ASIC, or SoC backend experience, particularly high-pin-count or high-power devices. Experience in automotive or high-reliability product qualifications (AEC-Q / ISO standards). Familiarity with advanced packaging: 2.5D/3D, fan-out WLP, heterogeneous integration. Knowledge of supply chain risk mitigation, dual sourcing, and volume scaling strategies. Experience with automation, traceability systems, and smart factory/manufacturing analytics. Job Type: Regular Shift: Shift 1 (Taiwan) Primary Location: Taipei, Taiwan (Remote) Additional Locations: Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. About Altera Altera: Accelerating Innovators Altera provides leadership programmable solutions that are easy-to-use and deploy in applications from cloud to edge, offering limitless AI possibilities. Our end-to-end broad portfolio of products including FPGAs, CPLDs, Intellectual Property, development tools, System on Modules, SmartNICs and IPUs provide the flexibility to accelerate innovation. Altera is helping to shape the future through pioneering innovation that unlocks extraordinary possibilities for everyone on the planet. Don't see the dream job you are looking for? Click "Get Started" below to drop off your contact information and resume and we will reach out to you if we find the perfect fit.

Responsibilities

The Senior OSAT Engineer will lead outsourced assembly and test engineering activities, focusing on new product introduction, yield optimization, and qualification activities. This role involves collaborating with OSAT suppliers and cross-functional teams to ensure manufacturing readiness and performance.