Senior Packaging Engineer at Advanced Micro Devices, Inc

Singapore, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

16 Jul, 26

Salary

0.0

Posted On

17 Apr, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Packaging design, Signal integrity, VNA, TDR, High-speed oscilloscope, Test board design, Impedance characterization, S-parameters, PCIE, DDR, HFSS, SIwave, ADS, Electromagnetic theory, Digital circuit analysis

Industry

Semiconductor Manufacturing

Description

WHAT YOU DO AT AMD CHANGES EVERYTHING At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: The Signal Integrity engineering team ensures the performance of the product is met through the integration of silicon, package and platform electrical design. Singapore Signal Integrity Lab provides design support to engineering teams for both current and forward-looking product development and design optimization. THE PERSON: As a member of the Singapore Signal Integrity team, you will be responsible for the electrical design and characterization of high-speed signaling and power delivery networks in AMD products covering package, connector and board. You will be required to communicate effectively and work in close collaboration with others in AMD as well as with AMD’s customers to ensure optimal engineering design decisions and efficient problem solving. KEY RESPONSIBILITIES: Experience in packaging, cable, socket or connector and board design for signal integrity Experience in measurement tools VNA, TDR and high-speed oscilloscope Experience in test board design, measurement fixtures and de-embedding methodologies Experience in analog & impedance characterization and processing of s-parameters Knowledge in high-speed digital signaling interfaces such as PCIE and DDR is a plus Knowledge in electrical modeling EDA tools such as HFSS, SIwave, ADS, etc. is a plus Knowledge in electromagnetic theory and digital circuit analysis is a plus Ability to collaborate and work across different functional teams and different sites Self-driven and can work independently PREFERRED EXPERIENCE: Skillful in SI characterization including VNA and TDR Experience in [S] processing and Impedance analysis ACADEMIC CREDENTIALS: Bachelor/MS degree Electrical/Microwave Engineering LOCATION: Singapore #LI-JK1 Benefits offered are described: AMD benefits at a glance. AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process. AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here. This posting is for an existing vacancy.

Responsibilities

You will be responsible for the electrical design and characterization of high-speed signaling and power delivery networks in AMD products. This includes collaborating with internal teams and customers to ensure optimal engineering design decisions and efficient problem solving.