Senior Packaging Engineer (Power Module) at Texas Instruments

Hang Tuah Jaya Municipal Council, Malacca, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

31 May, 26

Salary

0.0

Posted On

02 Mar, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Process Development, Power Module, Component Attach, Stack-up, Molding, PCB Manufacturing, Substrate Manufacturing, Laminate Manufacturing, Wire Bonding, FMEA, Control Plan, JMP Analysis, Stress Modeling, FEA, DFM, SPC

Industry

Semiconductor Manufacturing

Description

Change the world. Love your job. As a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the industry’s top engineering minds at your disposal. TI’s corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the work place-you will be treated with respect, dignity, kindness and courtesy. 2 available positions: 1. Power Module 1. Optimizing and establishing robust and high-speed process parameters for various component attach processes, stack-up, and molding (transfer or compression) technology 2. Defining simplified manufacturing process sequence for different components attach 3. Broad and deep technical understanding of PCB / Substrate / Laminate / MIS manufacturing. 2. Leaded Module 1. Optimizing and establishing robust and high-speed process parameters for multi chip attach processes, stack-up, and wire bonding technology 2. Defining simplified manufacturing process sequence for power stage package 3. Broad and deep technical understanding of leadframe / DBC / MIS manufacturing. Responsibilities Include: * Managing multiple new product executions starting from kick-off, product prototyping, characterization, learning cycles, and qualifications until product released with engineering approach such as JMP analysis, FMEA, control plan, etc. * Collaborate closely with factory operations teams to meet manufacturing indices, quality standards, and cost entitlements * Engaging with global package platform and emerging technology team to execute differentiated technology roadmaps to establish process capabilities in front of needs * Enabling TI power modules package competitiveness through adopting the industry latest greatest capabilities and maximize package design flexibility for adapting the latest technology. * Work with multi function to enable stress modeling to understand the package design weak point and define the contingency plan to overcome it. Why TI? * Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics. * We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI [https://edbz.fa.us2.oraclecloud.com/hcmUI/CandidateExperience/en/sites/CX/pages/4012] * Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. About Texas Instruments Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com [https://www.ti.com/]. Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. If you are interested in this position, please apply to this requisition. TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.

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Responsibilities

Responsibilities include managing multiple new product executions from kick-off through release using engineering approaches like FMEA and control plans, while collaborating with factory operations to meet quality and cost targets. The role also involves engaging with global teams to execute technology roadmaps and enabling package competitiveness by adopting the latest industry capabilities.