Start Date
Immediate
Expiry Date
03 May, 26
Salary
0.0
Posted On
02 Feb, 26
Experience
10 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Chip Pad Ring, Substrate Interconnect Scheme, Package Layout Design, Circuit Design, Signal Integrity, RTL, Place and Route, Substrate Layout, System Design, Programming, Scripting, Perl, Python, Tcl, Cadence Skill, Excel
Industry
Computer Hardware Manufacturing