Senior Packaging Technical Engineer - Hardware at NVIDIA

Bengaluru, karnataka, India -

Full Time

Start Date

Immediate

Expiry Date

02 Aug, 26

Salary

0.0

Posted On

04 May, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Chip pad ring design, Substrate interconnect, Package layout design, Transmission line theory, Power delivery, Signal integrity, Perl, Python, Tcl, Cadence Skill, Excel, Circuit design, RTL, Place and route, System design

Industry

Computer Hardware Manufacturing

Description

NVIDIA has continuously reinvented itself. Our invention of the GPU sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. Today, research in artificial intelligence is booming worldwide, which calls for highly scalable and massively parallel computation horsepower that NVIDIA GPUs excel. NVIDIA is a “learning machine” that constantly evolves by adapting to new opportunities that are hard to solve, that only we can address, and that matter to the world. This is our life’s work to amplify human creativity and intelligence. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join our diverse team and see how you can make a lasting impact on the world! We are now looking for a Senior Packaging Technical Engineer. NVIDIA has continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI — the next era of computing. What you’ll be doing: Your responsibilities include defining the chip pad ring, substrate interconnect scheme, and lead the package layout design process. We collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers. Work to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package! Communicate effectively with various teams throughout the company What we need to see: BSEE or equivalent experience. Minimum of 8+ years in board/system design. Experience with package design is preferred. Good understanding of transmission line theory, power delivery and signal integrity is desired. Strong programming and scripting skills in Perl, Python, Tcl desired, Cadence Skill and EXCEL familiarity are helpful. Enthusiastic and able to work with a minimum of supervision. You seek to solve complex technical problems. With competitive salaries and a generous benefits package, NVIDIA is widely considered to be one of the technology world’s most desirable employers. We welcome you join our team with some of the most hard-working people in the world working together to promote rapid growth. Are you passionate about becoming a part of a best-in-class team supporting the latest in GPU and AI technology? If so, we want to hear from you. #LI-Hybrid NVIDIA pioneered accelerated computing. Today, our AI infrastructure powers global intelligence, transforming every industry. Learn more about NVIDIA.

Responsibilities

You will define chip pad rings, substrate interconnect schemes, and lead the package layout design process. You will also collaborate with cross-functional teams to define chip floor plans and implement robust electrical packages.