QUALIFICATIONS YOU MUST HAVE

• Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM) and minimum 10 years prior relevant experience or an Advanced Degree in a related field and minimum 7 years of experience or in absence of a degree, 14 years of relevant experience

QUALIFICATIONS WE PREFER

• Working experience with thermal/structural analysis of CCAs, PWBs, and metal housings
• Direct experience with mechanical design and electronic packaging
• Working knowledge of Environmental testing equipment, procedures and qualification activities (e.g. RTCA DO-160 or MIL-STD-810G)
• An active US Department of Defense (DoD) security clearance or the ability to obtain a US Department of Defense (DoD) security clearance in the future

POSITION ROLE TYPE:

Hybrid
U.S. Citizen, U.S. Person, or Immigration Status Requirements:
U.S. citizenship is required, as only U.S. citizens are authorized to access information under this program/contract.

WHAT YOU WILL DO

• Conduct and resolve thermal, structural, and mechanical design challenges, ensuring optimal system performance.
• Lead the design and development of complex mechanical and electronic packaging solutions with minimal oversight.
• Collaborate with cross-functional teams to deliver development and production hardware that meets performance, cost, and schedule requirements.
• Review and approval of product definition data.
• Generate development hardware designs that meet objectives and facilitate the delivery of the hardware on schedule.
• Process engineering changes within schedule that meet performance metrics.
• Utilize standard work and CORE/ACE tools to continuously improve the design process.
• Mentor other engineers in process-related and/or technical subjects