Start Date
Immediate
Expiry Date
25 May, 26
Salary
0.0
Posted On
24 Feb, 26
Experience
5 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Process Engineering, Package Development, Thin Wafer Handling, SPS Solder Attach, PQFN, QFN, WLCSP, Leaded Packages, Semiconductor Assembly, SPC, Statistical Analysis, JMP, Change Management, Cost Saving, Yield Management, Communication Skills
Industry
Semiconductor Manufacturing