Senior Process Engineer at Renesas Electronics

George Town, Penang, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

13 Jul, 26

Salary

0.0

Posted On

14 Apr, 26

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Semiconductor back-end assembly, Die bonding, Wire bonding, Process setup, Process optimization, Yield improvement, Troubleshooting, Root cause analysis, New product introduction, Process qualification, Statistical methods, SPC, CPK, Trend analysis, Failure analysis, Reliability testing

Industry

Semiconductor Manufacturing

Description

Job Description We are seeking a Process Engineer with a minimum of 2 years of hands-on experience in semiconductor back-end assembly processes, particularly die bonding and wire bonding. The successful candidate will be responsible for process setup, optimization, yield improvement, and troubleshooting to ensure stable and high-quality manufacturing performance. The role requires strong technical understanding of back-end equipment, materials, and process interactions, as well as the ability to analyze data, drive continuous improvement, and support production operations. Key Responsibilities Develop, optimize, and sustain die bond and wire bond processes to meet quality, yield, and reliability requirements Perform process troubleshooting and root cause analysis for yield loss, defects, and equipment issues Support new product introduction (NPI), process qualification, and transfer to mass production Establish and maintain process parameters, work instructions, and control plans Analyze process data using statistical methods (e.g. SPC, CPK, trend analysis) Collaborate with cross-functional teams including Production, Quality, Equipment, and R&D Drive continuous improvement activities for cost, yield, cycle time, and reliability Qualifications Qualifications and Skills Bachelor’s degree in Engineering (Materials, Mechanical, or related field) Minimum 2 years of experience in semiconductor back-end assembly Strong knowledge of die bonding and wire bonding processes Familiarity with back-end materials such as lead frames, substrates, adhesives, and bonding wires Experience with process characterization, DOE, and data analysis is an advantage Good problem-solving, communication, and teamwork skills. Additional Advantage: Experience with QFN, or similar packages is added advantage. Knowledge of yield improvement, reliability testing, and failure analysis Exposure to automation, equipment setup, and process optimization Additional Information Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’ At Renesas, you can: Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things. Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure. Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day. Are you ready to own your success and make your mark? Join Renesas. Let’s Shape the Future together. Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement. We have adopted a hybrid model that gives employees the ability to work remotely two days a week while ensuring that we come together as a team in the office the rest of the time. The designated in-office days are Tuesday through Thursday for innovation, collaboration and continuous learning. Employment Type: Regular (PERM) Remote Work Available: No

Responsibilities

Develop, optimize, and sustain die bond and wire bond processes to meet quality, yield, and reliability requirements. Perform process troubleshooting, root cause analysis, and support new product introduction and mass production transfers.