US > Arizona > Phoenix
Step into a career with ASM, where cutting edge technology meets collaborative culture.
For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.

QUALIFICATIONS:

• Master’s degree and above, Material Science, Physics, Chemical Engineering preferred.
• 7-10 years’ experience for thin film deposition equipment development.
• Experience of PLC and customer penetration will be preferred.
• Experience with packaging customer engagement, new production penetration, Demo, and field issue collaboration, will be preferred.
• Experience with the theory, practice, and interpretation of materials characterization techniques such as XPS, SIMS, RBS, AFM, XRD, HRTEM, FESEM, Auger, Raman and ellipsometry.
• ~20-30% traveling for customer support.

SKILLS:

• Semiconductor background and basic knowledge
• Ability to independently manage complex process development projects, including personnel, project schedules, experimental thrusts, and hardware procurement.
• Ability to be a process consultant to internal and external customers.
• Demonstrated ability to develop and completely characterize deposition processes using experimental design techniques.
• Excellent verbal and written communication skills, with ability to clearly communicate advanced technical constructs in direct and concise manner.

• Key product unit (KPU) process engineer, responsible for semiconductor packaging application thin film deposition equipment hardware qualifications, process development.
• Engage with multiple type R&D activities for plasma etching, cleaning, and thin film deposition process.
• Work with multiple functions groups for product life cycle (PLC) release, fulfill product PLC requirement.
• Collaboration with engineering to define hardware solution, responsible for process development, reliability validation, NPI product transition from lab to customer site.
• Execute critical customer demo in lab, optimize process based on customer HVP.
• Engagement with customer (most from Asia) for product penetration, understand customer new requirement, new opportunity; Work with GPM to define new CIPs, convert customer requirement to BU projects.
• Partnered with local team to solve customer issue, close customer escalation, travel to customer site for support as needed.
• Partnered with software team to enhance system throughput, define software CIPs to improvement system level efficiency.