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Senior Project Manager Package Development at Infineon Technologies AG Australia

Malacca City, Malacca, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

12 Feb, 26

Salary

0.0

Posted On

14 Nov, 25

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Project Management, Semiconductor Technology, Advanced Packaging Technologies, Assembly Processes, PCB Manufacturing, Chip Embedding, Power Module Packaging, Quality Requirements, Cross-Functional Team Leadership, Communication Skills, Multicultural Environment, Mechanical Engineering, Electrical Engineering, Material Science, Physics, IPMA Certification

Industry

Semiconductor Manufacturing

Description

Support package platform assessments between subcons, as well as second source introduction Support Subcon/Technology roadmap alignment A Master degree in Mechanical/Electrical/Material Science/ Physics disciplines or related qualifications. PhD is a plus. Minimum 7 years of experience in semiconductor technology o manufacturing and assembly At least 5 years of experience in leading complex development projects and IPMA C certification or equivalent. A strong technical background and experience with advanced packaging technologies and assembly processes. Knowledge in PCB manufacturing, Chip Embedding, Power Module packaging and assembly including related manufacturing processes is a plus. Experience of working with or within semiconductor subcontractors. Good understanding of quality requirements of semiconductor products, as well as packages. The ability to work in and lead cross-functional and global teams in multicultural environment Strong communication skills in English and Chinese, German is a plus We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.

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Responsibilities

Support package platform assessments and second source introduction. Align Subcon/Technology roadmaps.