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Senior R&D Package design Engineer at onsemi
Zhubei, Taiwan, Taiwan -
Full Time

Start Date

Immediate

Expiry Date

29 Dec, 25

Salary

0.0

Posted On

30 Sep, 25

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

No

Skills

Package Design, Circuit Layout, Package Simulations, Design Review, Performance Verification, Wire Bond BGA, LGA, PGA, MCP, Flip Chip Package, WLCSP, Collaboration, Product Engineering, Test Engineering, Applications Engineering, Hardware Development

Industry

Semiconductor Manufacturing

Description
Lead imager package product design activities including: schematic and package netlist definition; package circuit layout; package simulations; package design review and approval; and package product performance verification. Provide direct design support for imager package product designs including wire bond BGA/LGA/PGA, MCP (multichip package), flip chip package and WLCSP (wafer level chip scale package). Work directly with Product Design, Design Integration, Product Engineering, Test Engineering, Applications Engineering, Hardware Development, Marketing, Packaging R&D, Packaging NPD, Purchasing, OSAT’s, and key package material suppliers.
Responsibilities
Lead imager package product design activities including schematic and package netlist definition, layout, simulations, design review, and performance verification. Provide direct design support for various imager package product designs.