Senior/Staff Engineer, HIG HBM PSE (Media Health Manufacturing) at Micron Technology

, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

08 Apr, 26

Salary

0.0

Posted On

08 Jan, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Electrical Engineering, Electronics Engineering, Problem Solving, Root Cause Analysis, Circuit Analysis, Statistics, Data Analysis, Scripting, Leadership, Collaboration, Project Management, Manufacturing, Design Verification, Yield Improvement, Cost Reduction, Technical Decision Making

Industry

Semiconductor Manufacturing

Description

Optimized Test Coverage: The responsibility of ensuring optimized test coverage on all current and future HIG HBM design architectures and process nodes is a technical aspect of this role. This is crucial for maintaining the effectiveness and efficiency in high-volume manufacturing. Ensuring that these products are reliable and meet the necessary standards is a technical task that directly impacts the market readiness of the products. Support for New Product Design Validation: The role provides support for design verification and in-depth circuit of new products using CAD tools and Verilog simulations. This technical support is crucial for the development of new products and technologies. Yield Improvement and Cost Reduction: The role involves technical tasks like improving manufacturing test yields (Specifically related to Device Issues from the DRAM, Interface and Stacked Die Yield), reducing test time, and resolving yield-related issues. These activities are critical for cost reduction and meeting yield targets. Root Cause and Resolution of Manufacturing Test Flow Issue, Qual and RMA Device Issues Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization. Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions. Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development. Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products. Bachelors/Masters in Electrical and Electronics Engineering Degree or related field with 4+ years of experience in the semiconductor industry. Product Engineering experience is preferred. Demonstrating Strong Leadership Skills and Technical Skills, especially in problem solving with root cause understanding and solution space through in depth circuit analysis. Good knowledge of statistics and data analysis tools and scripting. Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment (from leading the team to leading technical programs). Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems. Strong sense of responsibility and accountability towards assigned role with professional work ethic. Excellent communication and presentation skills. Passionate about people leadership, with a drive toward ongoing learning and development in this area. Work on site in Singapore with international travel opportunity to US, Taiwan and Japan.

Responsibilities

The role involves ensuring optimized test coverage for HIG HBM design architectures and supporting new product design validation. Additionally, it includes yield improvement, cost reduction, and mentoring team members.