Start Date
Immediate
Expiry Date
12 Feb, 26
Salary
0.0
Posted On
14 Nov, 25
Experience
5 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Mold Process Engineering, IC Packaging, Manufacturing Engineering, Statistical Tools, Analytical Skills, Problem Solving, Design of Experiment, Assembly Knowledge
Industry
Semiconductor Manufacturing
How To Apply:
Incase you would like to apply to this job directly from the source, please click here