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Senior Staff Engineer Package Technology at Infineon Technologies AG Australia

Malacca City, Malacca, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

17 Feb, 26

Salary

0.0

Posted On

19 Nov, 25

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Semiconductor Technology, Microelectronics, Automation, Mechanical Engineering, Electrical Engineering, Electronics Physics, Semiconductor Packaging, Assembly, Test Knowledge, Communication, Collaboration, Negotiation, Solution-Finding, 8D Methodology, T6s Methodology, Internal Package Analysis, Reliability

Industry

Semiconductor Manufacturing

Description

Support Pre development for new Chip technology. Provide technical guidance/assistance when needed in the projects related to interaction topic. Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics). At least 5 years of working experience in the IC/semiconductor environment. Semiconductor Packaging, Assembly and Test knowledge. Good aptitude for communication, collaboration, negotiation and solution-finding. Experience in 8D & T6s methodology. Internal Package analysis/first-level reliability. We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.

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Responsibilities

Support pre-development for new chip technology. Provide technical guidance and assistance in projects related to interaction topics.