Senior Staff Engineer Package Technology at Infineon Technologies AG Australia

Malacca City, Malacca, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

10 Apr, 26

Salary

0.0

Posted On

10 Jan, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Semiconductor Technology, Microelectronics, Automation, Mechanical Engineering, Electrical Engineering, Electronics Physics, Semiconductor Packaging, Assembly Technology, Process Engineering, Equipment Engineering, Failure Analysis, Reliability Engineering, AutoCAD, 3D Drafting

Industry

Semiconductor Manufacturing

Description

To define and develop the right package for new products/technologies from BU/FE from concept, feasibility study until realisation. Your Role Key responsibilities in your new role Driver for technical definition (BOM, package design, Assembly technology, review PRP & project classification) activities for package projects with major changes/new package, risks and impact. Generate conceptual package outline and internal construction drawings, finalise and document the drawings and update the package drawings as needed. Define the package characteristic to meet the electrical, thermal, reliability and mechanical requirements. Coordinate the package Cost Estimation (A1-A3) and Cost Indication (A3). Contact partner and technical consultant for package definition to Business Division especially on BE assembly technology know how. Actively scout for new packaging technologies and keep in touch with package development at competitors/subcons. Your Profile Qualifications and skills to help you succeed Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical & Electronics Physics). At least 9 years of relevant working experience in IC/semiconductor environment. Semiconductor Packaging, Assembly and Test. Process and Equipment Engineering knowledge. Failure Analysis and Reliability Engineering. AutoCAD and 3D drafting preferred. #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.

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Responsibilities

The role involves defining and developing packaging for new products and technologies, overseeing technical definitions, and generating package outlines and drawings. Additionally, the engineer will coordinate cost estimations and scout for new packaging technologies.