Senior Staff Engineer-Physical Design at Infineon Technologies AG Australia
Bengaluru, karnataka, India -
Full Time


Start Date

Immediate

Expiry Date

17 Mar, 26

Salary

0.0

Posted On

17 Dec, 25

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

No

Skills

Physical Design Implementation, Timing Closure, Low Power SoCs, Package Co-Design, Floor Planning, Power Grid Design, Place and Route, Physical Verification Checks, Scripting Languages, 28nm Technology, 16nm Technology, 12nm Technology, Low Power Design Techniques, Mentoring, Communication Skills

Industry

Semiconductor Manufacturing

Description
Drive physical design implementation which includes package co-design, floor planning, power grid design and signoff, place and route, timing closure, physical verification checks. Job Description In your new role you will: Responsible for leading Physical Design and Timing Closure of low power SoCs. Responsible to achieve die area, performance, power goals for hierarchical blocks and top. Drive physical design implementation which includes package co-design, floor planning, power grid design and signoff, place and route, timing closure, physical verification checks. Influence tools, flows and methodology activities to improve upon QoR. Interact with cross-functional team members to improve design, methodology and process aspects. Enable next generation of place and route engineers via mentoring and thought leadership. Your Profile You are best equipped for this task if you have: Hands-on experience in physical design implementation and timing closure of large blocks/top Expert user of industry standard tools for physical design and signoff. Expert in scripting languages (shell, perl, tcl) and Make flow In-depth knowledge of 28nm/16nm/12nm technologies and associated physical design challenges Deep understanding of low power design techniques and implementation methodologies Should be self-motivated and take initiatives to drive new methodologies Should have strong written and verbal communication skills Contact: swati.gupta@infineon.com #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process. Click here for more information about Diversity & Inclusion at Infineon.

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Responsibilities
Lead Physical Design and Timing Closure of low power SoCs. Drive physical design implementation including package co-design, floor planning, and physical verification checks.
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