Senior Staff, Packaging Engineering at Sandisk

Batu Kawan, Penang, Malaysia -

Full Time

Start Date

Immediate

Expiry Date

26 Aug, 26

Salary

0.0

Posted On

28 May, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Packaging Engineering, SMT, PCBA, Solder Joint Reliability, Board-Level Reliability, Failure Analysis, PCB Layout, Machine Learning, Data Analytics, AI Technologies, Experimental Design, Statistical Analysis, Thermo-mechanical Analysis, DFX, DFM, DFA

Industry

Semiconductor Manufacturing

Description

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. Job Description We are seeking a detail-oriented and analytical Senior Staff, Packaging Engineering to join our team in Penang, Malaysia. In this role, you will drive innovation in packaging solutions while ensuring efficiency, quality, and compliance across all product lines. You will collaborate with cross-functional teams to design, develop, and optimize packaging systems that meet customer requirements and regulatory standards. The ideal candidate will bring a systematic approach to problem-solving and a commitment to continuous improvement in packaging technology. ESSENTIAL DUTIES AND RESPONSIBILITIES: Serve as the Package Engineering representative on cross functional leadership teams, setting technical direction and ensuring packages are fully characterized, qualified, and released to production on schedule while meeting stringent mechanical, electrical, performance, reliability, and quality requirements. Provide end to end ownership of the package lifecycle across design, development, qualification, and manufacturing, driving alignment among cross functional engineering teams, global factories, and key stakeholders. Lead global engagement with factories and contract manufacturers to enable robust, scalable, and cost effective high volume introduction of new package designs and advanced assembly processes. Partner with Packaging R&D organizations worldwide to define, develop, and qualify next generation and emerging packaging technologies in alignment with long term business strategy and product roadmaps Drive enterprise level assembly yield improvement initiatives and package cost reduction programs, establishing best practices and measurable performance targets across supported product lines. Own package technology roadmaps, oversee budgets for supported products, and guide the development of scalable packaging infrastructure to support future growth and technology transitions. Lead new products through the transition from low volume to high volume manufacturing, ensuring yield, quality, and reliability objectives are achieved. Establish and enforce readiness of FMEA, SOD, Control Plans, process recipes, SPC, and other critical assembly controls prior to high volume production. Provide technical leadership in evaluating and validating design options through characterization builds and comprehensive DFX (Design for excellence) analyses, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework), influencing product architecture and manufacturing strategy at the system level. Qualifications REQUIRED: Master’s degree or PhD in Material Science, Manufacturing, Mechanical Engineering, Computer Science, Physics or other engineering disciplines. Minimum 10 years of relevant work experience with a Master's degree, or 8+ years of experience with a PhD. Proficient understanding of packaging domains including SMT, PCBA, solder joint reliability, board-level reliability, packaging materials, failure analysis, and PCB layout Additional expertise in flash back-end process for active components manufacturing is a plus Experience with machine learning and data analytics utilizing AI technologies. SKILLS: Strong problem-solving skills with demonstrated expertise in experimental design and statistical analysis Excellent written and verbal communication skills with the ability to collaborate effectively with global cross-functional teams Knowledge of thermo-mechanical aspects of semiconductor packages and Solid-State Drives Assist in developing and maintaining the Package Technology Roadmap, working with global assembly, and packaging teams. Demonstrated experience mentoring or managing junior engineers is a plus Continuously track major industry benchmark announcements in packaging and proactively build organizational awareness of competitive and emerging benchmark strategies Familiarity with industry benchmarking trends and packaging technology roadmap development. Additional Information Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [email protected] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying. NOTICE TO CANDIDATES: Sandisk has received reports of scams where a payment is requested on Sandisk’s behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Sandisk Ethics Helpline or email [email protected]. Job Type (exemption status): Exempt position - Please see related compensation & benefits details below Business Function: Packaging Engineering Work Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office

Responsibilities

Lead the end-to-end package lifecycle from design and development to high-volume manufacturing for semiconductor products. Drive innovation in packaging technologies, manage technology roadmaps, and collaborate with global factories to ensure quality and cost-effectiveness.