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SiC Wafer & Package Technology Development Engineer at onsemi

Aschheim, Bavaria, Germany -

Full Time

Start Date

Immediate

Expiry Date

04 Aug, 26

Salary

0.0

Posted On

06 May, 26

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Package Design, Assembly Processes, Wafer Thinning, Sputter, Electroplating, Electroless Plating, Photolithography, Wafer Bonding, Wafer Level Packaging, Wirebond, Sintering, Die Attach, Clip Attach, Reflow, Molding, Material Interactions

Industry

Semiconductor Manufacturing

Description

Technical and customer support for the qualification of SiC die sales and development. The candidate must have knowledge of package design, assembly processes and interactions with device. onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. More details about our company benefits can be found here: https://www.onsemi.com/careers/career-benefits [https://www.onsemi.com/careers/career-benefits] We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

Responsibilities

Provide technical and customer support for the qualification of SiC die sales and development. Lead development projects and implement global strategies regarding package design and assembly processes.