SIPI Architect for High-Speed SerDes at Apple
, California, United States -
Full Time


Start Date

Immediate

Expiry Date

03 Mar, 26

Salary

0.0

Posted On

03 Dec, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

No

Skills

Signal Integrity, Power Integrity, SerDes Technologies, Interconnect Protocols, System-Level Co-Design, Channel Modeling, Link Budget Analysis, Equalization Techniques, Clocking, Power Delivery, Cross-Functional Team Leadership, Technical Consensus, Data Center Systems, High-Performance Computing, Emerging Interconnect Technologies, Thermal Co-Design

Industry

Computers and Electronics Manufacturing

Description
In this position, you will work with the team that develops SoCs. In this high-impact role, you will define and own the end-to-end signal and power integrity strategy for cutting-edge high speed SerDes. You will be responsible for ensuring robust interconnect performance from silicon to system. This position requires deep expertise in leading-edge SerDes technologies (224G+), modern interconnect protocols, and system-level co-design. DESCRIPTION As the SIPI Architect, you will define and own the end-to-end signal and power integrity architecture for high-speed SerDes interconnects. You will guide technical direction across various teams, lead system-level trade-off analyses, and ensure design robustness through advanced modeling and validation. MINIMUM QUALIFICATIONS BS and 10 +years of relevant industry experience. PREFERRED QUALIFICATIONS MS or PhD in Electrical Engineering or a related field with 10+ years of relevant industry experience. Deep expertise in system-level SIPI for high-speed SerDes (112G/224G and beyond). Proven experience architecting solutions for high-performance interconnects using standards such as Ethernet, PCIe, UAL and CXL. Expert in end-to-end channel modeling and link budget analysis, including statistical (e.g., COM) and time-domain simulation. In depth understanding of SerDes TX/RX equalization techniques, clocking and power delivery trade-offs. Experience leading cross-functional teams and driving technical consensus across silicon architecture, circuit design, packaging and system hardware groups. Experience designing interconnects for large-scale systems such as those in data center or high-performance computing (HPC) environments. Familiarity with emerging interconnect technologies, including co-packaged optics (CPO), and advanced packaging (e.g., 2.5D/3D integration). Familiarity with system-level power integrity (PDN) and thermal co-design for large-scale, high-power ASICs.
Responsibilities
As the SIPI Architect, you will define and own the end-to-end signal and power integrity architecture for high-speed SerDes interconnects. You will guide technical direction across various teams and ensure design robustness through advanced modeling and validation.
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