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SOC Thermal Engineer at Apple

Santa Clara, California, United States -

Full Time

Start Date

Immediate

Expiry Date

14 Jan, 26

Salary

0.0

Posted On

16 Oct, 25

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Thermal Design, Thermal Analysis, Cooling Solutions, High Power SOC, Semiconductor Design, PCB Design, Thermal Testing, IC Physical Design, Low-Power Techniques, Thermal Analysis Methods, Advanced Packaging, Data Center Cooling, Experimental Setup, Data Collection, Ansys Ice Pak, Fluent, Cadence Allegro

Industry

Computers and Electronics Manufacturing

Description

Do you love working on challenges that no one has yet solved? Do you like changing the game? Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. We are looking for a self-motivated and ambitious individual who will work closely with multi-functional teams to optimize mobile device’s thermal performance and participate in advanced IC packaging research and development. DESCRIPTION The Thermal Engineer will design and validate cooling solutions for high-performance computing systems. The role involves simulation, testing, and cross-functional collaboration to ensure thermal performance and reliability across product lines. MINIMUM QUALIFICATIONS BS + 10 years of industry experience. PREFERRED QUALIFICATIONS MSEE + 10 years of industry experience. Extensive experience in thermal design, analysis and validation of advanced cooling solutions for high power SOC. Knowledge of semiconductor, package, PCB or mobile device design and thermal testing. Experience working with IC physical design parameters affecting electrical and thermal performance of packaging technologies. Knowledge of SoC design methodology, low-power techniques and thermal analysis methods. Knowledge of advanced packaging assembly processes along with electrical and thermal characteristics of packages. Tool Familiarity: Ansys Ice Pak, Sentinel-TI, Fluent, Cadence Allegro, Redhawk, etc. Experience of data center cooling solution analysis, design and test. Experience of experimental setup and data collection.

Responsibilities

The Thermal Engineer will design and validate cooling solutions for high-performance computing systems. The role involves simulation, testing, and cross-functional collaboration to ensure thermal performance and reliability across product lines.