BENEFITS

• AWS + Variable Bonus
• 2-way company transport (Yishun, Woodlands, Jurong East, Sengkang)
• Subsidized meals at company canteen (nearby coffee shops available)
• Overseas training & project allowance

REQUIREMENTS

• Degree in Computer Science, Software Engineering, Electrical Engineering, or related field.
• 3–5 years’ relevant software development experience (semiconductor or manufacturing preferred).
• Proficient in C++ for embedded systems, automation, or UI/UX development.
• Knowledge of data analytics, AI/ML, or computer vision is an advantage.
• Strong problem-solving ability, detail-oriented, and adaptable in a fast-paced environment.
• Open to travel (Hong Kong, China, SEA) for training and projects (travel allowance provided).

ABOUT THE ROLE

We are looking for a passionate Software Engineer to join our team in developing and optimizing advanced packaging semiconductor equipment. You will design, implement, and test high-performance software that enhances automation, control, and data processing. This is a hands-on role where you will collaborate with cross-functional teams to deliver innovative and reliable solutions for the semiconductor manufacturing industry.

KEY RESPONSIBILITIES

• Design, develop, and maintain software for semiconductor equipment, including motion control, data acquisition, and automation.
• Collaborate with hardware and mechanical engineers to integrate software with precision components.
• Develop real-time and embedded systems software for high-speed, high-precision applications.
• Conduct software testing, debugging, and performance optimization.
• Implement AI, computer vision, and machine learning algorithms (where applicable).
• Ensure compliance with industry standards, cybersecurity protocols, and safety regulations.
• Prepare technical documentation and provide support/training to internal teams.
• Participate in continuous improvement initiatives to enhance scalability and maintainability.