Start Date
Immediate
Expiry Date
02 Jul, 26
Salary
0.0
Posted On
03 Apr, 26
Experience
2 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Soldering, Desoldering, BGA rework, QFN rework, Surface-mount technology, Through-hole assembly, Microscope operation, Thermal profiling, X-ray inspection, Schematic interpretation, IPC-A-610, J-STD001, IPC7711/7721, Electronic component identification, Failure analysis, Process improvement
Industry
Computer Hardware Manufacturing