Sr. Assembly TD Engineer: Advance PKG stacking at Micron Technology

Taichung, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

20 Mar, 26

Salary

0.0

Posted On

20 Dec, 25

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Assembly Process, Flip Chip, TCB, Solder Material, Data Analysis, Problem Solving, Process Development, Documentation, Collaboration, Innovation, Customer Focus, Technical Skills, Process Transfer, Efficiency Troubleshooting, DOE Planning, Material Science, Mechanical Engineering

Industry

Semiconductor Manufacturing

Description

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description: A senior assembly technology development engineer is responsible for introducing new technology to enable next generation packaging. This position engaged latest stacking/flip chip technology, advance packaging material and work on new process set up, process/ packaging characterization and process transfer from TD phase to high volume production to meet development milestone. This position required high motivation and operation skill to build DOE sample and fulfill customer requirement sample as well as cooperate with Material engineer, Bumping, PI, NPI, quality and manufacturing team to ensure process transfer successfully. Candidate should be familiar with Assembly process. the experience of flip chip, TCB and the solder material is preferred for this position. Responsibilities and Tasks: Follow Micron's culture , PITCC , people, innovation, tenacity, collaboration, customer focus. Help stakeholders to remove the gaps with inputs all around and connect team together to resolve the problems encounters during operations or manager's assignment Collaborate with stakeholders to use innovative way to resolve the problems and meet top-down requirements. To achieve the goal with tenacity manners no matter how difficult or how fuzzy it is. Define the problems, find the root cause and then, resolve it. Must have can-do mindset instead of complaints. Plan and execute new technology enablement Be familiar with Assembly process. the experience of flip chip, TCB is preferred. Explore new technology on semiconductor industry such as flip chip, TCB equipment and packaging material Provide plan and resource requirement to enable new technology Set up DOE plan and execute Build sample and perform data analysis skill Lead efficiency trouble shooting skill to improve process Prepare documentation for process transfer from TD to HVM Review process stability by FDC, SPC and test result Requirement Strong technical problem-solving and data analysis skill Open mindset to introduce new technology and process development Above 3 years experience on Assembly process Fluent in English communication Excellent communication skill Bachelor or Master degree in engineering as material science, mechanical, chemical engineering or physics and chemistry About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_taiwan@micron.com. Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron. AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Responsibilities

The senior assembly technology development engineer is responsible for introducing new technology for next-generation packaging and ensuring successful process transfer from TD phase to high volume production. This includes collaborating with various teams to resolve operational issues and meet development milestones.