Sr BAW R&D Process Integration Engineer at Qorvo
Apopka, FL 32703, USA -
Full Time


Start Date

Immediate

Expiry Date

16 Oct, 25

Salary

0.0

Posted On

17 Jul, 25

Experience

0 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

No

Skills

Physics, Solidworks, Rie, C++, Cmp, Drie, Sputtering, Tem, Thin Films, Network Analyzer, Sem, Mems, Wire Bonding, Cadence Virtuoso, Matlab, Profilometer, Python, Lithography

Industry

Information Technology/IT

Description

SR BAW R&D PROCESS INTEGRATION ENGINEER

Experience Level: Professional
Job Type: Regular
Location:Apopka, FL, US, 32703
Requisition ID: 9206
Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers’ most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.

SUMMARY:

Our Bulk Acoustic Wave (BAW) business is rapidly growing. Our BAW R&D team seeks a Sr BAW R&D Process Integration Engineer to focus on process integration and new technology development. In our ongoing effort to improve device performance and diversify our product spectrum, we need a creative person who can integrate complex thin film processes (more than ten levels of lithography). The ideal candidate is a technical person, who finds solving challenging problems to be a rewarding task.

QUALIFICATIONS:

  • PhD degree in physics, material science & engineering or related fields.
  • Curriculum or experience in MEMS, thin films integration or thin films for acoustic devices is required.
  • Relevant experience or prior internship in semiconductor/MEMS industry as a process integration / technology development engineer.
  • Experience or prior internship in developing/transferring processes from R&D to high volume manufacturing is desired.
  • Prior BAW / acoustic devices experience is a plus
  • Prior BAW process or device engineering experience or internship is a plus
  • Knowledge of the various standard semiconductor processing techniques (PVD, CVD, Thin Film Deposition (Sputtering, PECVD, ALD), SEM, EDS, TEM, XRD, Profilometer, Wire-bonding, lithography, Wet Etching, CMP, RIE, DRIE is desired.
  • Knowledge of Device Characterization tools: Vector Network Analyzer, Piezo-MEMS Analyzer, Laser Vibrometer, Holographic Microscope
  • Skills in MATLAB, C++, Python, COMSOL-Multiphysics, Keysight, Cadence Virtuoso, Solidworks, OriginPro desired.

    LI-KR1

Responsibilities

Our BAW business is growing rapidly, and we desire a highly motivated individual to be part of this opportunity.

  • The candidate will provide MEMS, thin films process integration support to include developing and transferring processes from R&D to high volume semiconductor manufacturing environment.
  • The candidate will support process engineering, design engineering and manufacturing teams.
  • Provide support for BAW resonators using AIScN thin films.
  • Conduct ferroelectric characterization of AlScN thin film capacitor devices
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