Sr. Die Bond Process Engineer at NXP Semiconductors

Kaohsiung, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

28 Jul, 26

Salary

0.0

Posted On

30 Apr, 26

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Die Attach Process, FDC, ADC, Semiconductor Manufacturing, Process Control, Yield Analysis, Defect Reduction, SPC, Cp/Cpk, GR&R, MSA, Process Automation, 8D, 5 Why, Root Cause Analysis, Data Analysis

Industry

Semiconductor Manufacturing

Description

1. Ensure high-quality and accurate implementation Responsible for FDC/ADC model setup based on solid process knowledge and failure analysis experience, ensuring model accuracy and minimizing rework. 2. Manage and reduce configuration risks Configure monitoring logic, thresholds, and rules to effectively distinguish true signals from noise, reducing false alarms and missed detections that may impact production. 3. Drive efficient project execution Ramp up on systems and processes, minimizing trial-and-error to ensure timely and effective implementation of FDC/ADC projects. 4. Collaborate across cross-functional teams Work closely with Process, Equipment, Manufacturing, and IT teams to align objectives, communicate technical insights, and drive decisions efficiently. 5. Support yield improvement and operational performance Leverage monitoring systems to enable actionable insights that contribute to quality improvement, yield enhancement, and manufacturing efficiency. 6. Ensure project continuity and long-term ownership Demonstrate strong role clarity and accountability, supporting stable system operation, continuous improvement, and sustained project ownership. Requirements: Basic Qualifications: At least 2 years of working experience in semiconductor manufacturing, preferably as a Die Attach Process Engineer. Master’s degree or above in engineering-related disciplines, such as Electrical Engineering, Mechanical Engineering, Materials Science, or Chemical Engineering. Technical and Analytical Skills: Solid knowledge of process control, yield analysis, defect reduction, and continuous improvement methodologies. Candidates with a statistics-related background are preferred, with the ability to apply data analysis techniques to process monitoring and improvement (e.g. SPC, Cp/Cpk, GR&R, MSA). Hands-on experience with FDC (Fault Detection & Classification) and ADC (Automatic Defect Classification) applications, capable of utilizing process and equipment data for abnormal detection, trend monitoring, and early warning. Experience in process automation applications, able to support system- or equipment-level automation projects to enhance process control and reduce manual operation risks. Quality and Customer Interface Experience: Experience in customer complaint handling and root cause analysis, familiar with structured problem-solving methodologies such as 8D, 5 Why. Ability to work effectively with cross-functional teams (Process, Quality, Equipment, and Suppliers) to drive corrective and preventive actions. Communication Skills: Good written and verbal English communication skills, capable of effective interaction with customers, suppliers, and internal teams. English proficiency equivalent to TOEIC 600 or above. Systems and Manufacturing Knowledge Ability to leverage system and automation data for process tracking, lot history review, abnormal analysis, and continuous improvement activities. More information about NXP in Greater China... #LI-2370 NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer, and more sustainable world through innovation. As the world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. For more information, visit www.nxp.com Bright Minds. Bright Futures. We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills. Commitment At NXP. We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future. We remain steadfast in our commitment to sustainability and making measurable year-on-year progress. Also, we aim to create an inclusive work environment and we will not tolerate racism, discrimination or harassment of any kind. We have programs in place focused on diversity, inclusion and equality. Thank you for considering a career at NXP. To help you prepare for the different steps in our hiring process, see the following useful advice and tips. Are you already an NXP employee? Do not apply here. Instead, you must apply via our internal career page. Thank you for your interest in supporting our recruitment efforts. Please note that NXP operates under a strict Preferred Supplier List (PSL) for all recruitment activities. Any candidate profiles or resume submitted without a prior written agreement or explicit request from our Talent Acquisition team will be considered unsolicited. Such submissions will be deemed free of any obligations, and no fees will be paid by NXP or any of its affiliates, subsidiaries, or divisions - regardless of whether the candidate is hired, either coincidentally or otherwise. Thank you for your understanding.

Responsibilities

The engineer will manage FDC/ADC model setups and configuration logic to ensure high-quality production and minimize rework. They will also collaborate with cross-functional teams to drive yield improvements and support long-term system ownership.