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SR ENGINEER, APTD Bonding / Wafer Thinning at Micron Technology

Taichung, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

23 Mar, 26

Salary

0.0

Posted On

23 Dec, 25

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Wafer Bonding, Wafer Thinning, Technology Development, Yield Improvement, Process Engineering, Root Cause Analysis, Materials Characterization, Mechanical Characterization, Testing, Data Presentation, Technical Reporting, Chip Stacking, 2.5D Technology, 3D Technology, Troubleshooting, Innovative Thinking

Industry

Semiconductor Manufacturing

Description

1. Drive improvement in wafer bonding/debonding (WSS) or wafer thinning performance. 2. Coordinate experiments for technology development and yield improvement 3. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Engage in process development projects with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technical specifications and roadmaps. 1. Must be at least 3 years experience in semiconductor related industry 2. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 3. Must have experience of wafer bond/debond (WSS) or Si grinding/CMP technologies 4. Innovative with independent thinking 5.

Responsibilities

The role involves driving improvements in wafer bonding and thinning performance, coordinating experiments for technology development, and troubleshooting complex problems. Additionally, the engineer will support advanced packaging technology research and development.