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SR ENGINEER, APTD PHOTO/BUMPING at Micron Technology

Taichung, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

12 Feb, 26

Salary

0.0

Posted On

14 Nov, 25

Experience

2 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Materials Characterization, Data Analysis, Technical Innovation, Equipment Maintenance, Mechanical Characterization, Test Structure Design, Design of Experiment Techniques, Statistical Process Control, Defect Analysis, Technical Problem-Solving, Multitasking, Communication Skills, Flexibility, PHOTO Process, Metal Plating Process, Fluent in English and Chinese

Industry

Semiconductor Manufacturing

Description

Materials Characterization Provide knowledge of leading-edge materials characterization techniques and new applications and data analysis methodologies. Drive improvement and technical innovation in materials, methods, and processes. Maintain a good theoretical and operating knowledge of all techniques in your area. Manage equipment maintenance by performing diagnostics and interacting with suppliers and the maintenance team. Provide first-line defense for the equipment. Coordinate mechanical characterization and testing for advanced packaging development efforts globally including US, Japan, and Singapore site. Provide recommendations for test structure and test vehicle design for material property evaluation. At least 3 years experience in semiconductor material related industry Degree/Major: Master degree in Chemistry, Material or related fields, PhD is preferred Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis Demonstrated experience with technical problem-solving skills with multitasking. Functioning both as individual contributor and as project leader Strong communication skills for collaboration cross teams Must be flexible in accommodating changing priorities and working hours to support business needs. Master/PhD with an engineering major or related field 3 years or above experience in PHOTO process / metal plating process in both front-end or assembly process. Fluent communication in both English and Chinese

Responsibilities

Provide knowledge of materials characterization techniques and drive improvement in materials and processes. Coordinate mechanical characterization and testing for advanced packaging development globally.