SR ENGINEER, PACKAGE PRE STACKING at Micron Technology

Taichung, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

16 Mar, 26

Salary

0.0

Posted On

16 Dec, 25

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Advanced Package Technology, Wafer Dicing Techniques, Process Development, Dicing Tape Evaluation, Assembly Processes, External Supplier Collaboration, SPC, Data Analysis, DOE Matrix Design, Problem Solving, Efficiency Problem Solving, Dicing Tool Operation, HBM, 3Di, Dicing Tool Evaluation, Wafer Grinding

Industry

Semiconductor Manufacturing

Description

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description ### Advanced package technology (HBM product) research and development, experience with wafer thin wafer dicing techniques such as laser grooving, blade saw, Stealth dicing, laser full cut and plasma dicing, and wafer grinding. ### Applies and engage advance dicing tool to complete process development. ### Experience with dicing tape material evaluation for different dicing processes and key material properties. ### Familiar with assembly and packaging processes such as hybrid bond, wafer mounting, wafer dicing, wafer thinning or grinding, etc. ### Require working with external suppliers to develop equipment and materials to support new assembly processes. ### Familiarity with SPC, JMP data analysis, and DOE matrix design for process development and problem identification, and solving using meticulous fixing methods. Familiarity with efficiency problem solving such as KT analysis, Five Whys Technique, 8D Problem Solving. Required Skills: ### More than 3 year of package process experience and understanding advance package technology such as HBM/3Di ### Familiar with dicing tool operate: DGP8761/DFL7161/DFL7362/DDS2300/DSD6362/SPTS Plasma ### Dicing tape evaluation experience About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_taiwan@micron.com. Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron. AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Responsibilities

The role involves advanced package technology research and development, focusing on wafer dicing techniques and process development. The engineer will also work with external suppliers to develop equipment and materials for new assembly processes.