Sr Engineer, Thin Films Development, Wafer Level Bonding at Micron Technology

Boise, Idaho, United States -

Full Time

Start Date

Immediate

Expiry Date

15 Jan, 26

Salary

0.0

Posted On

17 Oct, 25

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Thin Film Deposition, Characterization, Process Development, Analytical Skills, Problem Solving, Root Cause Analysis, Data Analysis, Statistical Techniques, Programming, Scripting, Semiconductor Processing, Solid-State Device Physics, Plasma Processing, Thermodynamics, Chemical Kinetics, Technology Development

Industry

Semiconductor Manufacturing

Description

Develop, optimize and characterize thin film processes to meet the requirements of pioneering advanced packaging products. Performing fundamental research to drive innovative solutions for next-generation products. Collaborating with process integration and other process development teams to develop innovative solutions. Optimizing deposition processes to reduce cost, process variability, GHG emissions, and improve process capability. Conducting root cause and failure mode analysis to understand the limitations of current hardware and driving vendors for solutions. Maintaining a technology development pilot manufacturing line. Support process transfer to production facilities (some minimal travel may be required). Ph. D. (or equivalent education) in Materials Science, Chemical Engineering, Chemistry, Physics, or other related technical fields. Extensive process development experience may substitute for Ph. Hands on experience of thin film deposition and characterization. Understanding of growth and characterization of thin films. Knowledge of thermodynamics, chemical kinetics and their direct application to films deposition; plasma processing and its impact on film properties are plus. Strong analytical and creative problem-solving skills, and experience using extensive technical knowledge to guide decisions and strategies for a project. Ability to resolve complex issues through root-cause or model-based problem solving Ability to work independently, with minimal direction, a focus on meeting commitments, and the ability to manage numerous projects simultaneously. The ability and willingness to learn new skills as needed. Experience in programming or scripting is desirable. Knowledge of semiconductor processing, solid-state device physics, and of thin film deposition or plasma physics is desirable. Proficiency with data analysis, DOE, and statistical techniques is assumed. Data science experience is a plus

Responsibilities

Develop and optimize thin film processes for advanced packaging products while conducting fundamental research for innovative solutions. Collaborate with various teams to enhance deposition processes and maintain a pilot manufacturing line.