Start Date
Immediate
Expiry Date
28 Aug, 26
Salary
73500.0
Posted On
30 May, 26
Experience
2 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Equipment Operation, Micro-assembly, Die Bonding, Wire Bonding, Encapsulation, MES, Blueprint Interpretation, Cleanroom Protocols, ESD Prevention, Troubleshooting, Visual Inspection, Lean Six Sigma, Mentoring, Technical Reading
Industry
Semiconductor Manufacturing
How To Apply:
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