Start Date
Immediate
Expiry Date
08 Mar, 26
Salary
0.0
Posted On
08 Dec, 25
Experience
5 year(s) or above
Remote Job
Yes
Telecommute
Yes
Sponsor Visa
No
Skills
Assembly Process, Yield Improvement, Cost Reduction, Process Optimization, Flip Chip Bonding, Die Bond, Grinding, DOE, SPC, FDC, RMS, APC, Material Management, Quality Assurance, Audit Support, English Communication
Industry
Semiconductor Manufacturing