Sr Manager/Manager, Advanced Packaging Technology Development at Micron Technology

, , Singapore -

Full Time

Start Date

Immediate

Expiry Date

07 Apr, 26

Salary

0.0

Posted On

07 Jan, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Advanced Packaging Solutions, Collaboration, Technical Leadership, Data Analytics, Process Modeling, Statistical Analysis, Equipment Development, Problem Solving, Resource Utilization, Project Management, Technology Decision Making, Cross Department Leadership, Process Control, Yield Improvement, Reliability Performance, Fiscal Year Objectives

Industry

Semiconductor Manufacturing

Description

Your responsibilities include but are not limited to collaborating with internal and external partners to building and implement strategies aligned to organizational and business objectives by delivering high performing and cost-effective advanced packaging solutions on time with highest quality and predictable reliability performance. Develop and Communicate Advanced Packaging Technology Development Strategy Develop and communicate Advanced Packaging Technology Development strategic objectives Understand the impact and implications of APTD strategy to the overall company strategy and direction Ensure accuracy, quality, and timeliness of results Guide best utilization of resources to achieve end results Ensure critical work, milestones and goals are met by the team Set fiscal year technical objectives and insure they are aligned with department objectives Demonstrate understanding of technology complexity and effective technology decision making Provide technical leadership that may influence company direction Represent APTD in providing cross department leadership in area of responsibility Work effectively with peers in other department to develop and drive multi-functional initiatives B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields 8 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics. Experience with Visual Basic for automation and tool integration. Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control. Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding. Experience in equipment development with fundamental understanding of post probe and assembly process and equipment interactions Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability Consistent track record to solve problems and address root causes Ability to multi-task and manage numerous projects simultaneously Tenacity to work effectively under timelines and limited resources

Responsibilities

The role involves collaborating with partners to develop and implement strategies for advanced packaging solutions. It requires ensuring that critical work and milestones are met while guiding resource utilization effectively.