SR MGR, MMTN ME DE at Micron Technology

Tainan, , Taiwan -

Full Time

Start Date

Immediate

Expiry Date

11 Mar, 26

Salary

0.0

Posted On

11 Dec, 25

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Wafer Fabrication, Root Cause Analysis, Process Control, Product Evaluation, Equipment Performance, Workstation Capacity, Cycle Time Management, Action Plans Development, Collaboration, Yield Improvement, Quality Assurance, Team Development, Strategic Planning, Tactical Planning, Automation Systems, Line Management

Industry

Semiconductor Manufacturing

Description

Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Evaluates products to ensure they meet the required design and performance specifications. Collaborate with the Equipment team to drive continual improvements in DRY ETCH equipment performance. Collaborate seamlessly with Product Engineering and Industrial Engineering teams to assess workstation capacity and identify improvements for efficiency, while maintaining adherence to Cycle Time and Business Plan objectives. Develop and successfully implement action plans to capitalize on opportunities and mitigate risks. Partner with PIE and SIC teams to ensure readiness for new technology nodes and new part types. Collaborate with HVM/ADTT Product Engineering and Electrical Engineering teams to manage and improve area constraints dynamically. Coordinate with the OI team on MAS scheduling, automation, and line management systems, ensuring their successful implementation to shift teams. Coordinate tool qualification, release, installation requirements, and maintenance priorities for DRY ETCH tools, ensuring outstanding execution. Work closely with PIE teams to improve yield and quality, ensuring world-class standards are met. Champion strong collaborations across departments to meet Fab needs and foster strong peer relationships. Develop and manage interpersonal resource plans, training plans, and business processes to meet Business Plan objectives effectively. Proven experience in equipment engineering management, specifically focusing on DRY ETCH. Outstanding strategic and tactical planning skills. Excellent collaboration and communication skills. Strong ability to develop and implement effective action plans. Experience with automation and line management systems, ensuring flawless operations. Demonstrated leadership and team development skills, driving ambitious goals and encouraging a collaborative environment.

Responsibilities

Troubleshoots wafer fabrication problems and performs root cause analysis while collaborating with various teams to improve processes and equipment performance. Develops and implements action plans to capitalize on opportunities and mitigate risks in the manufacturing environment.