JOB QUALIFICATIONS:

• BS or MS in an engineering or science discipline
• 5+ years of experience in process engineering in a high-volume semiconductor manufacturing environment preferred
• Previous experience in Photolithography or Metrology is preferred
• Previous experience with ASML 400-750 Scanners, Cannon 3000iW Stepper, TEL ACT8 Track, Archer AIM+, Archer 200, KLA 5200, KLA 8100 is preferred
• Ability to generate, analyze, and interpret equipment and process performance data and produce a timely action plan to resolve recurring failures
• Demonstrated presentation skills. Candidate will be called upon to train others and present complex datasets and process problems/ solutions to diverse audiences.
• Competent in troubleshooting problems and capable of applying logic to isolate and repair them.
• Strong verbal and written communication skills.
• Ability to interact professionally with manufacturing and equipment engineering to deal with issues and priorities.
• Good foundational problem solving skills with creative solutions and out-of-the-box thinking.
• Self-motivated; able to take initiative and effectively prioritize work for self.
• A strong desire to help create a positive, winning, world class working environment.
• Previous experience in Lean Manufacturing methods is highly desirable.
  More information about NXP in the United States…
  NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.
  

  LI-56e

PHOTOLITHOGRAPHY / METROLOGY PROCESS ENGINEER RESPONSIBLE FOR MULTIPLE PROCESSES IN A HIGH VOLUME MANUFACTURING FACILITY. ENGINEER WILL BE RESPONSIBLE FOR BUT NOT LIMITED TO THE FOLLOWING:

• Reducing defectivity
• Reducing cycle time
• Improving tool utilization and availability
• Identification and reduction of recurrent machine faults
• Reducing cost
• Reducing scrap / Improving yield
• Supporting development activities
• Developing and writing specifications
• Implementation of Six-Sigma statistical process control methods
• Capacity planning and modeling
• Participating in and/or leading cross-functional and lean activity teams
• Training others