Sr. Process Engineer - Sputter at Knowles Corporation

Cazenovia, New York, United States -

Full Time

Start Date

Immediate

Expiry Date

26 Aug, 26

Salary

0.0

Posted On

28 May, 26

Experience

5 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Sputter Deposition, Physical Vapor Deposition, Process Engineering, Statistical Process Control, Design of Experiments, GD&T, CAD Engineering Drawings, Root Cause Analysis, Project Management, Lean Six Sigma, Data Analysis, Vacuum Methods, Metrology, Clean Room Operations, Yield Improvement, Thin Film Technology

Industry

electrical;Appliances;and Electronics Manufacturing

Description

Job Overview: The Process Engineering group at Knowles Precision Devices is responsible for process engineering, yield improvement and new process introduction. The Knowles Thin Film Build-to-Print Product Line includes RF and microwave components for applications in telecom, aerospace and defense markets. This position is a hands-on engineering role with project management responsibilities for an experienced deposition engineer in solving complex problems, while providing support to operations through improving yield, improving the flow of parts and implementing new equipment. This is a fast-paced position, working on parallel projects that require time and project management skills to support the short-term and long-term needs of the company. Salary and title are dependent on experience. #KPD Duties & Responsibilities: * Sustaining multiple sputter deposition tools and platforms as well as the pre-sputter clean operations. Maintain all necessary work/job instructions for the area. * Running equipment, processes and experiments in an operational environment. * Lead and coordinate yield improvement projects in the sputter area. * Training operators and mentoring junior engineers. * Have a collaborative mindset to tackle yield issues and excursions within a multidisciplinary team environment. * Participating in the Material Review Board (MRB) and Failure Review Board (FRB) for Root Cause investigations. * Comply with and support company policies and programs regarding safety, security, ISO, EEO, OSHA. Minimum Qualifications & Skills: * 5+ years of experience supporting manufacturing in process engineering, QA or continuous improvement roles * 1-3 years of direct experience with semiconductor or thin film physical vapor deposition techniques such as sputtering or evaporation. Knowledge and experience in other plasma or vacuum methods, such as dry etching, is also accepted. Understanding of required metrology a must. * Bachelor of Science in engineering or science, or equivalent experience * Experience with statistical methods (e.g., DoE and SPC) and data analysis tools (e.g., JMP, Minitab, MATLAB, Python) * Experience reading and understanding CAD engineering drawings using GD&T * Experience measuring and validating workmanship to drawing specifications * Experience authoring job instructions and work instructions * Strong written and verbal communication skills, communicating to both operators and management * Willingness to train others and work as a member of inter-disciplinary teams * Must be able to perform lab duties in an ISO certified clean room, meeting gowning, ESD, and EHS requirements. * Due to US Export Regulations all candidates must be a U.S. person (i.e. U.S. Citizen, lawful permanent resident, or protected individual) Qualifications & Skills that will make you an outstanding candidate: * Experience with linear sputtering tools such as KDF and Semicore * Experience depositing metal films on ceramic and glass substrates * Experience or training in project management; A PMP or CAPM certificate is a plus * Experience or training in Lean Six Sigma methodology; a Greenbelt or above is a plus

Responsibilities

Responsible for sustaining sputter deposition tools, improving yield, and implementing new equipment for RF and microwave components. The role involves leading root cause investigations and mentoring junior engineers within a multidisciplinary team.