Sr. Staff Engineer Package Technology WB at Infineon Technologies

Wuxi City, Jiangsu, China -

Full Time

Start Date

Immediate

Expiry Date

04 Sep, 26

Salary

0.0

Posted On

06 Jun, 26

Experience

10 year(s) or above

Remote Job

Yes

Telecommute

Yes

Sponsor Visa

Skills

Wire Bond, Ball Bond, Process Optimization, PFMEA, SPC, APC, DOE, 8D, DMAIC, Semiconductor Packaging, Technical Leadership, Statistical Data Analysis, Equipment Setup, Knowledge Transfer, Supplier Management, Process Specification

Industry

Semiconductor Manufacturing

Description

You’re responsible to perform process (Wire Bond (ball bond-Al/Cu) development activities including process parameters scouting, optimization, verification and process freeze ect.. Your Role Key responsibilities in your new role 1. Perform process development activities (process parameters scouting, optimization, verification and process freeze) 2. Establish and setup new assembly process capabilities including hands-on equipment setup 3. Support prototype and development samples build 4. Responsible or support for technical handshake and knowledge transfer to Operations. 5. Drive and liaise with suppliers for continuous improvement and perform verification and qualification activities for new tooling, machines and materials in Development projects 6. Generate and update relevant documents, e.g. Process Specification, PFMEA, OJTI, PDR 7. Be the technical lead for task force and complex problem solving team using statistical and analytical tools, eg SPC, APC, DOE, 8D, FMEA 8. Provide inputs for updating of related documents and is responsible for their correct contents, eg Process of Record, Assembly Design Rule, Failure catalogue, Control Plan, Maintenance checklist Your Profile Qualifications and skills to help you succeed 1. Bachelor or Master’s Degree in Mechanical, Electrical or Electronics Engineering, Material Science, Metallurgical Engineering or a related discipline 2. At least 10 years of working experience in semiconductor packaging 3. Prior experience in Map mold, SON, TO, DSO power product development is strongly preferred 4. Strong hands-on knowledge and skills in Wire Bond (ball bond-Al/Cu) process 5. Statistical data analysis, analytical, and problem-solving skills, eg DoE, 8D, DMAIC 6. Good communication, presentation skills & Microsoft office 7. Good aptitude for collaboration, negotiation and solution finding 8. Competent in daily oral & written English for cross-functional and overseas communication Contact: minfang.zhou@infineon.cn, LinkedIn #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in? We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels. We look forward to receiving your resume, even if you do not entirely meet all the requirements of the job posting. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process. Click here for more information about Diversity & Inclusion at Infineon.

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Responsibilities

Responsible for Wire Bond process development, including parameter scouting, optimization, and verification for semiconductor packaging. The role involves leading technical task forces, managing supplier relations for tooling, and ensuring knowledge transfer to operations.